Flexible Electronics News

STMicroelectronics Unveils New Pressure Sensor Technology

Fully molded package incorporating an isolated sensing element offers industry-leading precision for absolute pressure measurement

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By: DAVID SAVASTANO

Editor, Ink World Magazine

STMicroelectronics announced a new, ST-patented technology that isolates the pressure-sensing element within a fully molded package to meet the ultra-small form factor requirements and design creativity for the next generation of portable consumer devices. Integrating the isolated pressure-sensing element in a fully molded package, this unique technology enables fully encapsulated wire bonding with zero risk of corrosion, elimination of wire bonding damage during pick and place assembly, zero...

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